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Semiconductor |
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Development and Consulting Services |
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Die bonding inspection - Corner chips, edge chips, large die scratches, oxidation |
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Die bonding alignment - Wafer row and column pattern search, flat recognition, die |
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Wire bonding alignment - Die pad recognition, die reference point recognition, lead |
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Wire bonding inspection - Pad pre-bond inspection, lead pre-bond inspection, post |
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Copyright © 2002 Imaging Vision, Inc. |
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